Setup, Compatibility & Care Instructions
Setup:
- Ensure the surfaces to be connected (component and heatsink) are clean and free of dust or old thermal material. Use isopropyl alcohol for cleaning.
- Carefully cut the GP-Ultimate thermal pad to the required size using sharp scissors or a craft knife. Avoid stretching the pad.
- Apply the cut pad directly onto the component or heatsink surface, ensuring full contact. Remove any protective films if present.
- Secure the heatsink onto the component, applying even pressure.
Compatibility:
The Gelid Solutions GP-Ultimate is compatible with a wide range of electronic components including MOSFETs, chipsets, memory modules (VRAM), CPUs, and other SMD components found on motherboards, graphics cards, servers, and other densely packed PCBs. Its 1mm thickness is suitable for gaps typically found in these applications.
Care:
- Store the thermal pad in its original packaging or a sealed bag in a cool, dry place away from direct sunlight.
- Avoid touching the pad's surface with bare hands to prevent contamination.
- If the pad needs to be removed, gently peel it off to avoid damaging components.